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Plastic SMT Packages & PCB Layout Information

Plastic SMT    Ceramic & Glass Metal    Connectorized Modules    Tape & Reel    Die Gel-Pak™/Waffle Pack

Outline drawings for all of Hittite's plastic sealed packages are shown along with suggested PCB land patterns for each SMT package.

Environmental Data Sheets

Note: The LP2, LP3, LP4 (LP4C), LP4B, LP5 & LP6 (LP6C), MS8G, MS10G, QS16G, S8G and ST89 packages have an exposed base for enhanced RF & thermal grounding performance.

Mouse over package name to click on Package Outline & Land Pattern drawing or Package Environmental Data Sheet.