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Quality Assurance Program

Hittite Microwave embraces Quality and Continuous Improvement in everything we do. For our customers, this means products that meet all requirements, delivered on-time and function reliably throughout their useful life. Our Quality Management System (QMS) is modeled after ISO 9001:2008. ISO 9001 is the worldwide quality standard in the semiconductor and many other industries. Hittite (Chelmsford, MA USA) is certified to ISO 9001 since 1997. In 2008, Hittite achieved AS9100-2009 certification for Aerospace industry. Hittite Microwave Corporation can supply products to customer specifications that follow the requirements outlined in MIL-PRF-38534/38535. Hittite is compliant to ISO/TS 16949 which adds more stringent requirements tailored to the automotive industry. In addition, Hittite Microwave has been audited and meets the requirements of the STACK International, StackTrack - Supplier Certification Program, S/001 Specification Issue 14 at Notice 1.

Our Quality Policy affirms that every Hittite employee and subcontractor is responsible for maintaining high quality, constantly searching for improvement in our procedures and processes:

  • Our designers adhere to conservative design rules and foundry specifications. Simulations are conducted to fully characterize the designs before mask release. Prior to a product’s release, it is fully characterized under varying conditions in order to generate data sheet minimum, typical, and maximum specifications.
  • Our wafer foundries have well established and qualified operations, with solid ISO9001 based quality programs.
  • Our IC subcontract assemblers also have well established, qualified operations, and ISO 9001 based quality systems. We specify the subcontractors’ standard assembly techniques and process steps in order to ensure consistent packaged MMIC products, delivered on schedule.
  • Our production facility in Chelmsford, Massachusetts employs automated die/packaged die handlers and test equipment to ensure consistency and compliance to the specification. All die products are 100% RF tested for selected critical parameters and 100% visual inspected to a commercial criteria based on MIL-STD-883 method 2010 B. All packaged products are 100% RF tested for selected critical parameters. Wafer, assembly, test, and inspection data is filed under the model and lot code number, ensuring that trace ability from wafer fabrication to completed product is maintained.
  • Our sales, applications, and marketing staff are available to provide our customers with superior support.

Qualification, Screening & Manufacturing Process Flows

Screening & Qualification of GaAs MMIC Products
Commercial Standard Product, Qualification & Monitoring Program
Standard Process for Plastic Encapsulated MMICs (LPCC, MSOP, QSOP, SOIC, SOT)
Standard Process for Commercial MMICs
Standard Process for Packaged MMICs (C8, G7, G8, G16, LM1, LM3, P7)
Standard Process for Connectorized Modules
Military Level (Class B) MMIC Die and Packaged Die Screen
Space Level MMIC Die Screening
Wafer Acceptance Flow for Space Qualified MMIC Die
LAT Flow for Space Qualified MMIC Die