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HMC814

x2 Active Multiplier Chip, 13 - 24.6 GHz Fout

Product Details

Data Sheet
ECCN: EAR99

Quality & Reliability

Qualification Test Reports
Waffle-Pak & Gel-Pak

Press & Media
Input Freq. (GHz) Function Output Freq. (GHz) Input Power (dBm) Output
Power (dBm)		 100 kHz SSB Phase Noise (dBc/Hz) Package
6.5 - 12.3 x2 Active 13 - 24.6 4 17 -136 Chip

Features

• High Output Power: +17 dBm
• Low Input Power Drive: 0 to +6 dBm
• Fo Isolation: >20 dBc @ Fout = 19 GHz
• 100 kHz SSB Phase Noise: -136 dBc/Hz
• Single Supply: +5V @ 88mA
• Die Size: 1.2 x 1.23 x 0.1 mm

Typical Applications

• Clock Generation Applications:
   SONET OC-192 & SDH STM-64
• Point-to-Point & VSAT Radios
• Test Instrumentation
• Military End-Use
• Sensors

Functional Diagram

General Description

The HMC814 is a x2 active broadband frequency multiplier chip utilizing GaAs PHEMT technology. When driven by a +4 dBm signal, the multiplier provides +17 dBm typical output power from 13 to 24.6 GHz. The Fo, 3Fo and 4Fo isolations are >20 dBc at 19 GHz. The HMC814 is ideal for use in LO multiplier chains for Pt-to-Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -136 dBc/Hz at 100 kHz offset helps maintain good system noise performance. All data is taken with the chip connected via two 0.025mm (1 mil) wire bonds of minimal length 0.31 mm (12 mils).