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HMC579

x2 Active Multiplier Chip, 32 - 46 GHz Fout

Product Details

Data Sheet
Application Notes
ECCN: EAR99

Quality & Reliability

Qualification Test Reports
Waffle-Pak & Gel-Pak

Press & Media

Product Press Release
Input Freq. (GHz) Function Output Freq. (GHz) Input Power (dBm) Output
Power (dBm)		 100 kHz SSB Phase Noise (dBc/Hz) Package
16 - 23 x2 Active 32 - 46 3 13 -127 Chip

Features

• High Output Power: +13 dBm
• Low Input Power Drive: 0 to +6 dBm
• Fo Isolation: >25 dBc @ Fout = 38 GHz
• 100 kHz SSB Phase Noise: -127 dBc/Hz
• Single Supply: +5V @ 70 mA
• Die Size: 1.18 x 1.23 x 0.1 mm

Typical Applications

• Clock Generation Applications:
   SONET OC-192 & SDH STM-64
• Point-to-Point & VSAT Radios
• Test Instrumentation
• Military EW / Radar
• Space

Functional Diagram

General Description

The HMC579 die is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology. When driven by a +3 dBm signal, the multiplier provides +13 dBm typical output power from 32 to 46 GHz. The Fo isolation is >25 dBc at 38 GHz. The HMC579 is ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -127 dBc/Hz at 100 kHz offset helps maintain good system noise performance.