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HMC576

x2 Active Multiplier Chip, 18 - 29 GHz Fout

Product Details

Data Sheet
Application Notes
ECCN: EAR99

Quality & Reliability

Qualification Test Reports
Waffle-Pak & Gel-Pak

Press & Media

Product Press Release

Life Cycle Status

Production, Recommended for New Designs
Input Freq. (GHz) Function Output Freq. (GHz) Input Power (dBm) Output
Power (dBm)		 100 kHz SSB Phase Noise (dBc/Hz) Package
9 - 14.5 x2 Active 18 - 29 3 17 -132 Chip

Features

• High Output Power: +17 dBm
• Low Input Power Drive: -2 to +6 dBm
• Fo Isolation: >20 dBc @ Fout= 24 GHz
• 100 kHz SSB Phase Noise: -132 dBc/Hz
• Single Supply: +5V @ 82 mA
• Die Size: 1.18 x 1.23 x 0.1 mm

Typical Applications

• Clock Generation Applications:
   SONET OC-192 & SDH STM-64
• Point-to-Point & VSAT Radios
• Test Instrumentation
• Military EW / Radar
• Space

Functional Diagram

General Description

The HMC576 die is a x2 active broadband frequency multiplier utilizing GaAs PHEMT technology. When driven by a +3 dBm signal, the multiplier provides +17 dBm typical output power from 18 to 29 GHz. The Fo and 3Fo isolations are >20 dBc and >30 dBc respectively at 24 GHz. The HMC576 is ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -132 dBc/Hz at 100 kHz offset helps maintain good system noise performance.