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HMC560

GaAs MMIC DBL-BAL Mixer Chip, 24 - 40 GHz

Product Details

Data Sheet
Application Notes
ECCN: EAR99

Quality & Reliability

Qualification Test Reports
Waffle-Pak & Gel-Pak

Press & Media
RF Freq. (GHz) Function IF Freq. (GHz) Conv. Gain (dB) LO/RF Isol. (dB) IIP3 (dBm) Package
24 - 40 +13 LO, DBL-BAL DC - 18 -8 35 21 Chip

Features

• Wide IF Bandwidth: DC - 18 GHz
• Input IP3: +21 dBm
• High LO/RF Isolation: 35 dB
• Passive Double Balanced Topology
• Compact Size: 1.14 x 0.59 x 0.1mm

Typical Applications

• Test Equipment & Sensors
• Microwave Point-to-Point Radios
• Point-to-Multi-Point Radios
• Military & Space

Functional Diagram

General Description

The HMC560 chip is a miniature passive double balanced mixer which is fabricated in a GaAs MESFET process, and can be used as an upconverter or downconverter from 24 - 40 GHz in a small chip area. The wide bandwidth allows this device to be used across multiple radio bands with a common platform. Excellent isolations are provided by on-chip baluns, and the chip requires no external components and no DC bias.


Measurements were made with the chip mounted and ribbon bonded into in a 50-ohm microstrip test fixture. Measured data includes the parasitic effects of the assembly. RF connections to the chip were made with 0.076mm (3-mil) ribbon bond with minimal length <0.31mm (<12 mil).