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HMC449

x2 Active Multiplier Chip, 27 - 33 GHz Fout

Product Details

Data Sheet
Application Notes
ECCN: EAR99

Quality & Reliability

Qualification Test Reports
Waffle-Pak & Gel-Pak

Press & Media

Product Press Release
Input Freq. (GHz) Function Output Freq. (GHz) Input Power (dBm) Output
Power (dBm)		 100 kHz SSB Phase Noise (dBc/Hz) Package
13.5 - 16.5 x2 Active 27 - 33 0 10 -132 Chip

Features

• Output Power: +10 dBm
• Wide Input Power Range:
   -4 to +6 dBm
• Fo Isolation: 34 dBc @
   Fout= 30 GHz
• 100 kHz SSB Phase Noise:
    -132 dBc/Hz
• Single Supply: 5V @ 50 mA
• Die Size: 1.10 x 1.20 x 0.1 mm

Typical Applications

• Point-to-Point & Multi-Point Radios
• VSAT Radios
• Military EW, ECM, C³I
• Test Instrumentation
• Space

Functional Diagram

HMC449 Functional Diagram

General Description

The HMC449 die is a x2 active broadband frequency multiplier chip utilizing GaAs PHEMT technology. When driven by a 0 dBm signal the multiplier provides +10 dBm typical output power from 28 to 32 GHz. The Fo and 3Fo isolations are >34 dBc and >17 dBc respectively at 30 GHz. The HMC449 is ideal for use in LO multiplier chains yielding a reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -132 dBc/Hz at 100 kHz offset helps maintain good system noise performance. All data is with the chip in a 50 ohm test fixture connected via 0.076 x 0.0127 mm (3mil x 0.5mil) ribbon bonds of minimal length 0.31mm (<12mils).