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HMC448

x2 Active Multiplier Chip, 19 - 25 GHz Fout

Product Details

Data Sheet
Application Notes
ECCN: EAR99

Quality & Reliability

Qualification Test Reports
Waffle-Pak & Gel-Pak

Press & Media
Input Freq. (GHz) Function Output Freq. (GHz) Input Power (dBm) Output
Power (dBm)		 100 kHz SSB Phase Noise (dBc/Hz) Package
9.5 - 12.5 x2 Active 19 - 25 0 11 -135 Chip

Features

• Output Power: +11 dBm
• Wide Input Power Range:
    -4 to +6 dBm
• Fo, 3Fo Isolation:
   >20 dBc @ Fout= 20 GHz
• 100 KHz SSB Phase Noise:
   -135 dBc/Hz
• Single Supply: 5V @ 48 mA
• Die Size: 1.16 x 1.20 x 0.1 mm

Typical Applications

• Clock Generation Applications:
   SONET OC-192 & SDH STM-64
• Point-to-Point & VSAT Radios
• Test Instrumentation
• Military & Space

Functional Diagram


HMC448 Functional Diagram

General Description

The HMC448 die is a x2 active broadband frequency multiplier chip utilizing GaAs PHEMT technology. When driven by a 0 dBm signal, the multiplier provides +11 dBm typical output power from 19 to 25 GHz. The Fo and 3Fo isolations are >22 dBc up to 22 GHz. This multi-rate frequency multiplier can be used in the generation of a half rate clock for 40 Gbps systems or as part of a multiplier chain to generate a full rate 40 Gbps clock.


The HMC448 is also ideal for use in LO multiplier chains for Pt to Pt & VSAT Radios yielding reduced parts count vs. traditional approaches. The low additive SSB Phase Noise of -135 dBc/Hz at 100 kHz offset helps maintain good system noise performance. All data is with the chip in a 50 ohm test fixture connected via 0.076 x 0.0127mm (3mil x 0.5mil) ribbon bonds of minimal length 0.31mm (<12mils).