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HMC361

InGaP HBT Divide-By-2 Chip, DC - 11 GHz

Product Details

Data Sheet
Application Notes
ECCN: 3A001.a.11.b

Quality & Reliability

Qualification Test Reports
Waffle-Pak & Gel-Pak

Press & Media

Product Press Release
Input Freq. (GHz) Function Input Power (dBm) Output
Power (dBm)		 100 kHz SSB Phase Noise (dBc/Hz) Bias Supply Package
DC - 11 Divide-by-2 -15 to +10 3 -148 +5V @ 83mA Chip

Features

• Ultra Low SSB Phase Noise:
   -148 dBc/Hz
• Wide Bandwidth
• Output Power: 3 dBm
• Single DC Supply: +5V
• Small Size: 1.14 x 0.69 x 0.1 mm

Typical Applications

• Satellite Communication Systems
• Fiber Optic
• Point-to-Point and
   Point-to-Multi-Point Radios
• VSAT

Functional Diagram


HMC361 Functional Diagram

General Description

The HMC361 is a low noise Divide-by-2 Static Divider with InGaP GaAs HBT technology that has a small size of 1.14 x 0.69 mm. This device operates from DC (with a square wave input) to 11 GHz input frequency with a single +5V DC supply. The low additive SSB phase noise of -148 dBc/Hz at 100 kHz offset helps the user maintain good system noise performance.