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HMC-MDB277

DBL-BAL Mixer Chip, 70 - 90 GHz

Product Details

Data Sheet
Application Notes
ECCN: 5A991.h

Quality & Reliability

Waffle-Pak & Gel-Pak

Press & Media

Featured Article
Product Press Release
RF Freq. (GHz) Function IF Freq. (GHz) Conv. Gain (dB) LO/RF Isol. (dB) IIP3 (dBm) Package
70 - 90 +14 LO, DBL-BAL DC - 18 -12 - - Chip

Features

  • Wide IF bandwidth: DC - 18 GHz
  • Passive Double Balanced Topology
  • LO Input Power: +14 dBm
  • Die Size: 1.55 x 1.4 x 0.1 mm

Typical Applications

• Short Haul / High Capacity Radios
• FCC E-Band Communication Systems
• Automotive Radar
• Sensors
• Test & Measurement Equipment

Functional Diagram

General Description

The HMC-MDB277 is a passive Double Balanced MMIC Mixer which utilizes GaAs Heterojunction Bipolar Transistor (HBT) Shottky diode technology and can be used as either an upconverter or a downconverter. All bond pads and the die backside are Ti/Au metallized and the Shottky devices are fully passivated for reliable operation.

The HMC-MDB277 Double Balanced Mixer is compatible with conventional die attach methods, as well as thermocompression and thermosonic wire bonding, making it ideal for MCM and hybrid microcircuit applications. This compact MMIC is a much smaller and more consistent alternative to hybrid style double balanced mixer assemblies. All data shown herein is measured with the chip in a 50 Ohm environment and contacted with RF probes.